SEMILEDS OPTOELECTRONICS CO., LTD.
Patent Owner
Stats
- 123 US PATENTS IN FORCE
- 1 US APPLICATIONS PENDING
- May 16, 2017 most recent publication
Details
- 123 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 2,240 Total Citation Count
- Nov 05, 2003 Earliest Filing
- 27 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2013/0277,702 Light Emitting Diode Device Having Electrode With Low Illumination Side And High Illumination SideApr 24, 13Oct 24, 13[H01L]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9653435 Light emitting diode (LED) package having short circuit (VLED) die, lens support dam and same side electrodes and method of fabricationJul 14, 15May 16, 17[H01L]
9537073 Method for fabricating a light emitting diode (LED) die having strap layerApr 14, 16Jan 03, 17[H01L]
9437794 Method of fabricating a flip chip light emitting diode (FCLED) die having N-conductor layerFeb 08, 16Sep 06, 16[H01L]
9419195 Light emitting diode (LED) die having strap layer and method of fabricationJul 27, 14Aug 16, 16[H01L]
9343620 Method for fabricating a light emitting diode (LED) die having protective substrateFeb 07, 14May 17, 16[H01L]
9343639 Light emitting diode (LED) device having lens protective structure and method of fabricationNov 29, 13May 17, 16[H01L]
9312455 Method for fabricating light emitting diode (LED) dice with wavelength conversion layersNov 14, 14Apr 12, 16[H01L]
9214456 Light emitting diode (LED) system having lighting device and wireless control systemNov 07, 12Dec 15, 15[H01L]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2015/0280,078 WHITE FLIP CHIP LIGHT EMITTING DIODE (FC LED) AND FABRICATION METHODAbandonedMar 31, 14Oct 01, 15[H01L]
2014/0151,630 PROTECTION FOR THE EPITAXIAL STRUCTURE OF METAL DEVICESAbandonedDec 04, 12Jun 05, 14[H01L]
2014/0051,197 METHOD FOR FABRICATING A VERTICAL LIGHT EMITTING DIODE (VLED) DIE HAVING EPITAXIAL STRUCTURE WITH PROTECTIVE LAYERAbandonedOct 28, 13Feb 20, 14[H01L]
2014/0048,766 METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE USING BOND PAD DAM AND WAVELENGTH CONVERSION LAYERSAbandonedAug 15, 12Feb 20, 14[H01L]
8614453 Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereofExpiredMay 27, 11Dec 24, 13[H01L]
2013/0240,834 METHOD FOR FABRICATING VERTICAL LIGHT EMITTING DIODE (VLED) DICE WITH WAVELENGTH CONVERSION LAYERSAbandonedMay 14, 13Sep 19, 13[H01L]
2013/0062,639 METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DEVICES HAVING OUTPUT WITH SELECTED CHARACTERISTICSAbandonedSep 12, 11Mar 14, 13[H01L]
2013/0057,178 LIGHT EMITTING DIODE (LED) SYSTEM HAVING APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) AND WIRELESS SYSTEMAbandonedNov 07, 12Mar 07, 13[H05B]
2013/0001,510 OPTOELECTRONIC DEVICE HAVING CURRENT BLOCKING INSULATION LAYER FOR UNIFORM TEMPERATURE DISTRIBUTION AND METHOD OF FABRICATIONAbandonedJun 28, 12Jan 03, 13[H01L]
2012/0327,663 Light Emitting Diode (LED) Lighting System Having Adjustable OutputAbandonedJun 22, 11Dec 27, 12[F21V]
2012/0168,714 VERTICAL LIGHT EMITTING DIODE (VLED) DIE AND METHOD OF FABRICATIONAbandonedJan 03, 11Jul 05, 12[H01L]
2012/0119,184 Vertical Light Emitting Diode (VLED) Die Having N-Type Confinement Structure With Etch Stop Layer And Method Of FabricationAbandonedNov 12, 10May 17, 12[H01L]
2012/0097,985 Light Emitting Diode (LED) Package And Method Of FabricationAbandonedOct 21, 10Apr 26, 12[H01L]
2012/0086,035 LED Device With A Light Extracting Rough Structure And Manufacturing Methods ThereofAbandonedNov 23, 11Apr 12, 12[H01L]
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